Substrate processing apparatus

ABSTRACT

Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2017-0111040, filed on Aug. 31, 2017, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a substrate processing apparatus, andmore particularly, to a cooling device capable of controlling thetemperature of a gas supply device.

2. Description of the Related Art

A substrate processing apparatus, for example, a semiconductor substrateprocessing apparatus, is heated to a process temperature to facilitate achemical reaction between reactive gases. For example, a peripheralportion surrounding a substrate, such as a reactor wall, or a reactorcover (for example, a top lid), is heated to a certain temperature. Assuch, as the entire reactor is heated and a temperature to which thereactor is heated is maintained, a process may be smoothly carried out.

However, the temperature of a particular portion of a reactor may not becontrolled in a high-temperature process. In such a case, thetemperature balance of the entire reactor may be destroyed, and thusprocess repeatability may deteriorate. For example, when the temperatureof a substrate support is 500° C. or more, the actual temperature of agas supply device, for example, a shower head, facing the substratesupport, may be higher than 250° C., which is higher than a settingtemperature of 200° C.

Moreover, when the temperature is not properly controlled, secondarydamage may occur, for example, in the form of a safety problem that mayoccur where a worker is burned due to the high temperature, malfunctiondue to thermal shock to major parts such as a valve, gauge, etc., achamber leak due to hardening of a sealing member such as an O-ring, aproblem where the quality of a deposited thin film deteriorates due tothe introduction of external air, etc.

SUMMARY

One or more embodiments include a device for controlling the temperatureof an upper portion of a reactor, in detail, a gas supply device, forexample, a shower head.

One or more embodiments include a cooling device having improved coolingefficiency.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, a cooling device including a firstpartition, a second partition surrounding the first partition, a thirdpartition surrounding the second partition, and a separator separating aspace between the second partition and the third partition into a firstarea and a second area, and separating a space between the secondpartition and the first partition into a third area and a fourth area,wherein the separator is configured to connect the first area and thethird area with each other and the second area and the fourth area witheach other.

The separator may include a body, a first channel, and a second channel,the first area and the third area may be connected to each other by thefirst channel of the separator, the second area and the fourth area maybe connected to each other by the second channel of the separator, andthe first channel and the second channel may not meet each other.

The first channel may be in an upper portion of the separator, and thesecond channel may be in a lower portion of the separator.

The separator may include a body, a first member located in an upperportion of the separator and between the second partition and the thirdpartition, a second member located in the upper portion of the separatorand between the first partition and the second partition, a third memberlocated in a lower portion of the separator and between the secondpartition and the third partition, a fourth member located in the lowerportion of the separator and between the first partition and the secondpartition, a first channel formed by the first member and the secondmember, and a second channel formed by the third member and the fourthmember, wherein the first area and the third area are connected to eachother by the first channel, the second area and the fourth area areconnected to each other by the second channel, and the first channel andthe second channel do not meet each other.

One surface of each of the first member, the second member, the thirdmember, and the fourth member may contact the second partition.

The first member and the third member may contact the third partition,and the second member and the fourth member may contact the firstpartition.

The first member, the second member, the third member, and the fourthmember may have the same height, and the first channel and the secondchannel each may have a same uniform width.

The cooling device may further include an inlet for introducing acoolant. When the inlet is located between the second partition and thethird partition, the separator may enable the coolant flowing in aclockwise direction between the second partition and the third partitionto continue to flow in a clockwise direction between the first partitionand the second partition, and the separator may enable the coolantflowing in a counterclockwise direction between the second partition andthe third partition to continue to flow in a counterclockwise directionbetween the first partition and the second partition. When the inlet islocated between the first partition and the second partition, theseparator may enable the coolant flowing in a clockwise directionbetween the first partition and the second partition to continue to flowin a clockwise direction between the second partition and the thirdpartition, and the separator may enable the coolant flowing in acounterclockwise direction between the first partition and the secondpartition to continue to flow in a counterclockwise direction betweenthe second partition and the third partition.

The cooling device may further include one or more grooves arrangedbetween the first partition and the second partition or between thesecond partition and the third partition.

According to one or more embodiments, a cooling device includes at leastone inlet, a fluid channel through which a coolant circulates, thecoolant being introduced through at least one inlet, a partitionseparating the fluid channel into a first area and a second area, and aseparator penetrating through the partition and extending across thefirst area and the second area, wherein the at least one inletintroduces the coolant into the first area, two flows of the coolantflowing in different directions are formed in the first area, and thetwo flows of the coolant flowing in different directions in the firstarea are introduced into the second area via the separator withoutcolliding or mixing with each other.

The separator may enable the coolant flowing in a clockwise direction inthe first area to continue to flow in a clockwise direction in thesecond area, and the separator may enable the coolant flowing in acounterclockwise direction in the first area to continue to flow in acounterclockwise direction in the second area.

According to one or more embodiments, a cooling device include a firstpartition, a second partition surrounding the first partition, a thirdpartition surrounding the second partition, and a separator separating aspace between the second partition and the third partition into a firstarea and a second area, and separating a space between the secondpartition and the first partition into a third area and a fourth area,wherein the separator is configured to connect the first area and thethird area with each other.

The separator may include a body and a channel, and the first area andthe third area are connected to each other by the channel of theseparator.

The separator may include a body, a first member located between thesecond partition and the third partition, a second member locatedbetween the first partition and the second partition, and a channelformed by the first member and the second member, wherein the first areaand the third area are connected to each other by the channel.

One surface of each of the first member and the second member maycontact the second partition.

The first member may contact the third partition, and the second membermay contact the first partition.

The first member and the second member may have a same height, and thechannel may have a uniform width.

When a flow direction of the coolant in the first area is a clockwisedirection, the separator may enable the coolant flowing in a clockwisedirection in the first area to continue to flow in a clockwise directionin the third area. When a flow direction of the coolant in the firstarea is a counterclockwise direction, the separator may enable thecoolant flowing in a counterclockwise direction in the first area tocontinue to flow in a counterclockwise direction in the third area.

According to one or more embodiments, a gas supply device including acooling device as described above may be provided.

According to one or more embodiments, a substrate processing apparatusincludes a chamber having an inner space surrounded by a top lid and anouter wall, at least one reactor located in the top lid and including agas supply device, at least one substrate support located on a wall ofthe chamber and facing the reactor, a reaction space formed between thereactor and the substrate support, and a cooling device provided overthe reactor or over the gas supply device.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic top view of a cooling device according to anembodiment;

FIG. 2 is a schematic top view of a cooling device according to anotherembodiment;

FIG. 3 is a schematic top view of a modified example of the coolingdevice of FIG. 1;

FIG. 4A is a perspective view of a separator used in the cooling devicesof FIGS. 1 and 3, and FIG. 4B illustrates that the separator is providedin a fluid channel;

FIGS. 5A to 5D are perspective views, in different directions, of theseparator used in the cooling device of FIG. 2;

FIGS. 6A and 6B are perspective views of the separator used in thecooling device of FIG. 2, showing an arrangement relationship of a body,a first channel, a second channel, and a partition;

FIGS. 7A and 7B are schematic top views of a cooling device according toother embodiments;

FIG. 8A is a perspective view of the separator used in the coolingdevice of FIGS. 7A and 7B, and FIG. 8B illustrates that the separator ofFIGS. 7A and 7B is provided in the fluid channel;

FIGS. 9A and 9B are, respectively, appearance and perspective views of acooling device according to another embodiment, and FIG. 9C illustratesa coolant flow path in the cooling device;

FIGS. 10A and 10B schematically illustrate a cover of the cooling deviceof FIG. 9A;

FIG. 11 is a cross-sectional view of the cooling device of FIG. 9A;

FIGS. 12A and 12B are perspective views of the cooling device of FIG. 9Abefore being covered with a cover;

FIGS. 13A and 13B are schematic top views illustrating various flowdirections of a coolant flowing in the cooling device, according toembodiments;

FIGS. 14A and 14B are schematic top views of cooling devices accordingto other embodiments;

FIGS. 15A and 15B are schematic top views of cooling devices accordingto other embodiments; and

FIG. 16 is a schematic cross-sectional view of a substrate processingapparatus including the cooling device, according to another embodiment.

DETAILED DESCRIPTION

Embodiments are provided to further completely explain the presentinventive concept to one of ordinary skill in the art to which thepresent inventive concept pertains. However, the present inventiveconcept is not limited thereto and it will be understood that variouschanges in form and details may be made therein without departing fromthe spirit and scope of the following claims. That is, descriptions onparticular structures or functions may be presented merely forexplaining embodiments of the present inventive concept.

Terms used in the present specification are used for explaining aspecific embodiment, not for limiting the present inventive concept.Thus, the expression of singularity in the present specificationincludes the expression of plurality unless clearly specified otherwisein context. Also, terms such as “comprise” and/or “comprising” may beconstrued to denote a certain characteristic, number, step, operation,constituent element, or a combination thereof, but may not be construedto exclude the existence of or a possibility of addition of one or moreother characteristics, numbers, steps, operations, constituent elements,or combinations thereof.

In the present specification, terms such as “first” and “second” areused herein merely to describe a variety of members, parts, areas,layers, and/or portions, but the constituent elements are not limited bythe terms. It is obvious that the members, parts, areas, layers, and/orportions are not limited by the terms. The terms are used only for thepurpose of distinguishing one constituent element from anotherconstituent element. Thus, without departing from the right scope of thepresent inventive concept, a first member, part, area, layer, or portionmay refer to a second member, part, area, layer, or portion.

Hereinafter, the embodiments of the present inventive concept aredescribed in detail with reference to the accompanying drawings. In thedrawings, the illustrated shapes may be modified according to, forexample, manufacturing technology and/or tolerance. Thus, the embodimentof the present inventive concept may not be construed to be limited to aparticular shape of a part described in the present specification andmay include a change in the shape generated during manufacturing, forexample.

FIG. 1 is a schematic top view of a cooling device according to anembodiment.

Referring to FIG. 1, the cooling device according to the presentembodiment may include a first partition 100, a second partition 200surrounding the first partition 100, a third partition 300 surroundingthe second partition 200, a separator 400 a, an inlet 500, and an outlet600.

A fluid channel may be formed by the first partition 100 and the thirdpartition 300. The second partition 200 is provided between the firstpartition 100 and the third partition 300 to separate the fluid channelinto two areas, that is, inner and outer areas 18 and 19. In theexemplified embodiment, an inner area 18 may be formed by the firstpartition 100 and the second partition 200, and an outer area 19 may beformed by the second partition 200 and the third partition 300.

The inlet 500 may be arranged between the second partition 200 and thethird partition 300. The inlet 500 may introduce a coolant between thesecond partition 200 and the third partition 300, that is, into theouter area 19, and may define two flows of the coolant flowing indifferent directions in the outer area 19. Since a deposition process isgenerally sensitive to temperature, temperature irregularity of a gassupply device (not shown) may affect the deposition process.Accordingly, as illustrated in FIG. 1, the inlet 500 may define twoflows of the coolant flowing in different directions, for example, aclockwise direction and a counterclockwise direction, in the outer area19. Accordingly, cooling unbalance between the left side and the rightside of the gas supply device may be prevented, and temperatureuniformity may be guaranteed.

The separator 400 a may be arranged on one surface of the fluid channelto separate a space between the second partition 200 and the thirdpartition 300, that is, the outer area 19, into a first area A and asecond area B, and a space between the second partition 200 and thefirst partition 100, that is, the inner area 18, into a third area C anda fourth area D. In this case, the separation of the outer area 19 intothe first area A and the second area B by the separator 400 a signifiesnot that the outer area 19 is completely separated into twoindependently areas, but that part of the outer area 19 is separatedinto the first area A and the second area B. In other words, althoughthe second area B of the outer area 19 is separated from the first areaA in a part of the cooling device, it may be connected to the first areain other part of the outer area 19. For example, referring to FIG. 1,although the outer area 19 is separated by the separator 400 a into thefirst area A and the second area B in a part of the cooling device (inan upper portion of the drawing), the first area A and the second area Bmay be connected to each other in other part of the cooling device (in alower portion of the drawing). As such, throughout the presentspecification, the expression “separated into two areas” does notsignify the separation of a space into two completely independent areas.

In the exemplified embodiment, the separator 400 a may be configured toextend between the third partition 300 and the first partition 100 bypenetrating through the second partition 200. Accordingly, the separator400 a may separate the outer area 19 into the first area A and thesecond area B, and the inner area 18 into the third area C and thefourth area D.

The separator 400 a may be configured to connect the first area A andthe third area C with each other and connect the second area B and thefourth area D with each other. Accordingly, the separator 400 a mayguide the coolant in the outer area 19 of the fluid channel to flowtoward the inner area 18, or the coolant in the inner area 18 of thefluid channel to flow toward the outer area 19. In the exemplifiedembodiment, the separator 400 a may be configured to connect the firstarea A and the third area C with each other, thereby guiding the coolantin the first area A to flow toward the third area C.

The separator 400 a may change a flow direction of the coolant flowingalong the fluid channel. For example, as illustrated in FIG. 1, the flowdirection of the coolant flowing clockwise in the first area A of theouter area 19 may be changed by the separator 400 a to thecounterclockwise direction in the third area C of the inner area 18.Likewise, the flow direction of the coolant flowing counterclockwise inthe second area B of the outer area 19 may be changed by the separator400 a to the clockwise direction in the fourth area D of the inner area18.

As such, the separator 400 a may guide the two flows of the coolant inthe outer area 19 to flow in different directions in the inner area 18.In the exemplified embodiment, the two flows of the coolant flowing indifferent directions in the outer area 19 (clockwise direction,counterclockwise direction) may also flow in different directions in theinner area 18 (counterclockwise direction, clockwise direction).

The two flows of the coolant flowing in different directions in theouter area 19 may flow in the inner area 18 by the separator 400 awithout collision or mixing therebetween. In other words, the separator400 a may prevent the two flows of the coolant flowing in differentdirections in the outer area 19 from colliding with each other. Indetail, the coolant flowing in the first area A may flow in the thirdarea C by the separator 400 a, not in the second area B or the fourtharea D.

For example, although the separator 400 a may have a partitionstructure, alternatively, the separator 400 a may have a structure asillustrated in FIGS. 4A and 4B.

In a selective or additional example, one or more grooves (not shown)may be arranged between the first partition 100 and the second partition200 and/or between the second partition 200 and the third partition 300.The grooves may define the flow direction of a coolant. Furthermore, thegrooves may increase cooling efficiency by increasing a contact areabetween the coolant and the cooling device.

The coolant flowing in the inner area 18 may be discharged through theoutlet 600 arranged between the first partition 100 and the secondpartition 200.

FIG. 2 is a schematic top view of a cooling device according to anotherembodiment. The cooling device according to the present embodiment maybe a modification of the cooling device according to the above-describedembodiment. Redundant descriptions between the embodiments may beomitted.

Referring to FIG. 2, the cooling device may include the first partition100, the second partition 200 surrounding the first partition 100, thethird partition 300 surrounding the second partition 200, a separator400 b, the inlet 500, and the outlet 600.

The separator 400 b may separate the space between the second partition200 and the third partition 300 into the first area A and the secondarea B, and the space between the second partition 200 and the firstpartition 100 into the third area C and the fourth area D. In theexemplified embodiment, the separator 400 b is configured to extendbetween the third partition 300 and the first partition 100 bypenetrating through the second partition 200.

The separator 400 b may connect the first area A and the third area Cwith each other and the second area B and the fourth area D with eachother.

Unlike FIG. 1, in which the first area A and the third area C arelocated at the same side with respect to the separator 400 a, in FIG. 2,the first area A and the third area C are located at different sideswith respect to the separator 400 b, and the second area B and thefourth area D are also located at different sides with respect to theseparator 400 b.

Due to the above configuration, the separator 400 b of FIG. 2, unlikethe separator 400 a of FIG. 1, may not change the flow direction of thecoolant flowing along the fluid channel. For example, as illustrated inFIG. 2, the coolant flowing in the clockwise direction in the outer area19 continuously flows in the clockwise direction in the inner area 18 bythe separator 400 b, and the coolant flowing in the counterclockwisedirection in the outer area 19 continuously flows in thecounterclockwise direction in the inner area 18 by the separator 400 b.

In the cooling device of FIG. 1, the coolant flowing in the outer area19 collides with the separator 400 a, and also the flow direction of thecoolant is changed in the inner area 18 by the separator 400 a. Forexample, as illustrated in FIG. 1, the coolant flowing in the clockwisedirection in the outer area 19 flows in the counterclockwise directionin the inner area 18 by the separator 400 a. As such, when the coolantcollides with the separator 400 a and the flow direction is changed, theflow speed of the coolant decreases and cooling efficiency is reduced.Furthermore, a coolant circulation speed may not be effectivelycontrolled. Accordingly, it is desirable to maintain the flow directionof the coolant by configuring the separator of the cooling device likethe separator 400 b of FIG. 2.

The structure of the separator 400 b of FIG. 2 will be described indetail with reference to FIGS. 5A to 5D.

FIG. 3 is a schematic top view of a modified example of the coolingdevice of FIG. 1.

Unlike FIG. 1, in the cooling device of FIG. 3, the inlet 500 isarranged between the first partition 100 and the second partition 200,and the outlet 600 is arranged between the second partition 200 and thethird partition 300.

Like FIG. 1, the separator 400 a may connect the first area A and thethird area C with each other and the second area B and the fourth area Dwith each other.

A coolant may be introduced into the inner area 18 of the fluid channelvia the inlet 500. The introduced coolant is separated into two flows ofthe coolant flowing in different directions along the first partition100 and the second partition 200. The two flows of the coolant may beintroduced into the outer area 19 without colliding or mixing with eachother due to the separator 400 a. In detail, the coolant flowing in thethird area C is introduced into the first area A by the separator 400 a,and the coolant flowing in the fourth area D is introduced into thesecond area B by the separator 400 a. The coolant introduced into theouter area 19 may be discharged through the outlet 600.

FIG. 4A is a perspective view of the separator 400 a used in the coolingdevice of FIGS. 1 and 3, and FIG. 4B illustrates that the separator 400a of FIG. 4A is provided in the fluid channel.

The separator 400 a may include a body 401 a, a first channel 402 a, anda second channel 403 a.

The first channel 402 a and the second channel 403 a are located atopposite surfaces facing each other, that is, a left surface and a rightsurface, of the body 401 a, and may be concave portions formed in thebody 401 a. The structures of the first channel 402 a and the secondchannel 403 a are not limited to the illustration of FIG. 4A. Forexample, although the first channel 402 a and the second channel 403 aare illustrated as concave portions having a flat surface,alternatively, they may be concave portions having a round surface.

Referring to FIG. 4B, the first area A and the third area C may beconnected to each other via the first channel 402 a of the separator 400a, and the second area B and the fourth area D may be connected to eachother via the second channel 403 a of the separator 400 a.

The first channel 402 a and the second channel 403 a may not meet eachother. Accordingly, the separator 400 a may prevent the two flows of thecoolant flowing in different directions from colliding with each other.In detail, in FIGS. 1 and 4B, the two flows of the coolant flowing indifferent directions in the outer area 19 may be introduced into theinner area 18 without colliding or mixing with each other due to thefirst channel 402 a and the second channel 403 a, and may flow indifferent directions in the inner area 18, and may be discharged throughthe outlet 600.

FIG. 4B illustrates that the coolant is introduced into the inner area18 through the first channel 402 a and the second channel 403 a from theouter area 19.

The separator 400 a may be arranged across the outer area 19 and theinner area 18. In the exemplified embodiment, the separator 400 aextends from the third partition 300 to the first partition 100 bypenetrating through the second partition 200. The body 401 a, with thesecond partition 200, may prevent the coolant flows flowing in differentdirections from being mixed with each other.

FIGS. 5A to 5D are perspective views of the separator 400 b used in thecooling device of FIG. 2, viewed from different directions. FIG. 5A is aperspective view of the separator 400 b used in the cooling device ofFIG. 2, viewed from the upper right side. FIG. 5B is a perspective viewof the separator 400 b used in the cooling device of FIG. 2, viewed fromthe upper left side. FIG. 5C is a perspective view of the separator 400b used in the cooling device of FIG. 2, viewed from the lower left side.

The separator 400 b may include a body 401 b, a first member 111, asecond member 222, a third member 333, a fourth member 444, a firstchannel 402 b, and a second channel 403 b.

The first member 111 to the fourth member 444 may be separatelymanufactured and attached to the body 401 b, or may be integrally formedwith the body 401 b.

The first channel 402 b may be formed by the first member 111 and thesecond member 222. The second channel 403 b may be formed by the thirdmember 333 and the fourth member 444.

The first channel 402 b is configured to connect the first area A andthe third area C with each other, and the second channel 403 b isconfigured to connect the second area B and the fourth area D with eachother. In other words, the first area A and the third area C may beconnected to each other by the first channel 402 b of the separator 400b, and the second area B and the fourth area D may be connected to eachother by the second channel 403 b of the separator 400 b.

The first channel 402 b and the second channel 403 b may not meet eachother. For example, the first channel 402 b and the second channel 403 bmay be located at opposite surfaces facing each other, that is, an uppersurface and a lower surface, of the body 401 b.

In detail, as illustrated, the first member 111 and the second member222 are provided in an upper portion of the separator 400 b.Accordingly, the first channel 402 b may be formed in the upper portionof the separator 400 b. The third member 333 and the fourth member 444are provided in a lower portion of the separator 400 b. Accordingly, thesecond channel 403 b may be formed in the lower portion of the separator400 b. Thereby, the separator 400 b may prevent the two flows of thecoolant flowing in different directions from colliding with each other.The structures of the first channel 402 b and the second channel 403 bare not limited to the illustration of FIGS. 5A to 5D. For example, thefirst channel 402 b and the second channel 403 b may have an inclinedstructure.

Referring to FIGS. 2 and 5A-5D, one of the two flows of the coolantflowing in different directions in the outer area 19 may be introducedinto the inner area 18 through the first channel 402 b in the upperportion of the separator 400 b, and the other coolant flow may beintroduced into the inner area 18 through the second channel 403 b inthe lower portion of the separator 400 b. In other words, the two flowsof the coolant flowing in different directions in the outer area 19 maybe introduced into the inner area 18 through the upper and lowerportions of the separator 400 b without colliding or mixing with eachother, may also flow in different directions in the inner area 18, andmay be discharged through the outlet 600. FIG. 5D illustrates that thecoolant is introduced into the inner area 18 through the first channel402 b and the second channel 403 b from the outer area 19.

FIGS. 6A and 6B are perspective views of the separator 400 b used in thecooling device of FIG. 2, showing a mutual arrangement relationship ofthe body 401 b of the separator 400 b, the first member 111, the secondmember 222, the third member 333, the fourth member 444, the firstchannel 402 b, the second channel 403 b, and the first to thirdpartitions 100 to 300.

Referring to FIGS. 2, 6A and 6B, the body 401 b may be arranged acrossthe outer area 19 and the inner area 18. For example, the body 401 b mayextend from the third partition 300 to the first partition 100 bypenetrating through the second partition 200.

The first member 111 formed in the upper portion of the separator 400 bmay be located between the second partition 200 and the third partition300. The second member 222 formed in the upper portion of the separator400 b may be located between the first partition 100 and the secondpartition 200. The third member 333 formed in the lower portion of theseparator 400 b may be located between the second partition 200 and thethird partition 300. The fourth member 444 formed in the lower portionof the separator 400 b may be located between the first partition 100and the second partition 200.

In order to prevent the coolant in the first area A from being mixedwith the coolant flowing through the second channel 403 b, and thecoolant in the second area B from being mixed with the coolant flowingthrough the first channel 402 b, an area between the second member 222and the third member 333 (indicated by a reference letter X in FIG. 5A)and an area between the first member 111 and the fourth member 444(indicated by a reference letter Y in FIG. 5B) should be blocked. Tothis end, the second partition 200 may be arranged to cover the area Xand the area Y. To completely block the area X and the area Y, a width xof the area X and a width y of the area Y may be less than or equal to athickness w3 of the second partition 200. In this case, one surface ofeach of the first member 111, the second member 222, the third member333, and the fourth member 444 may come in contact with the secondpartition 200. In detail, the second partition 200 may contact onesurface of the third member 333 in the first area A, one surface of thefirst member 111 in the second area B, one surface of the fourth member444 in the third area C, and one surface of the second member 222 in thefourth area D. Accordingly, the separator 400 b, with the secondpartition 200, may prevent the coolant flows flowing in differentdirections from being mixed with each other.

A length I of the separator 400 b may be less than or equal to adistance between the first partition 100 and the third partition 300. Insome embodiments, as illustrated in FIG. 6A, the length I of theseparator 400 b may be the same as the distance between the firstpartition 100 and the third partition 300. In this case, the firstmember 111 and the third member 333 may contact the third partition 300,and the second member 222 and the fourth member 444 may contact thefirst partition 100. Accordingly, the separator 400 b, with the firstpartition 100 and the third partition 300, may prevent the coolant flowsflowing in different directions in the inner area 18 and the outer area19 from being mixed with each other. For example, the coolant flowing inthe first area A may be prevented from flowing toward the second area Bthrough the side surface of the separator 400 b, and the coolant flowingin the third area C may be prevented from flowing toward the fourth areaD.

The first member 111 and/or the second member 222 may contact a cover(not shown) of the cooling device. Accordingly, the separator 400 b,with the cover of the cooling device, may prevent the coolant flowsflowing in different direction in the inner area 18 and the outer area19 from being mixed with each other. For example, the coolant flowing inthe first area A may be prevented from flowing toward the second area Bthrough the upper portion of the separator 400 b, and the coolantflowing in the third area C may be prevented from flowing toward thefourth area D through the upper portion of the separator 400 b.

A continuity equation for a fluid is shown as the following Equation 1,which may be induced from the law of conservation of mass. It may beseen from the continuity equation that a flow velocity decreases as asectional area increases, and the flow velocity increases as thesectional area decreases.

Q=A1×V1=A2×V2,   [Equation 1]

where “Q” denotes a flow rate, “Al” denotes a sectional area at a firstpoint, “V1” denotes a flow velocity at the first point, “A2” denotes asectional area at a second point, and “V2” denotes a flow velocity atthe second point.

In the embodiment of FIG. 6A, a distance wl between the third partition300 and the second partition 200 may be the same as a distance w2between the second partition 200 and the first partition 100. Theheights of the first partition 100, the second partition 200, and thethird partition 300 may be the same as “h.” In this case, since asectional area (w1×h) of the outer area 19 and a sectional area (w2×h)of the inner area 18 are the same, according to the continuity equation,a fluid velocity “vo” in the outer area 19 may be the same as a fluidvelocity “vi” in the inner area 18 (∵ vo/vi=(w2×h)/(w1×h)=1). Thus, anupper portion of a reactor may be cooled more uniformly.

In the embodiment of FIG. 6B, a height “h1” of the first member 111, aheight “h2” of the second member 222, a height “h3” of the third member333, and a height “h4” of the fourth member 444 may be the same.Furthermore, the first channel 402 b may have a uniform width, that is,w4 =w4′, and the second channel may have a uniform width, that is,w5=w5′. A width “w4” of the first channel 402 b and a width “w5” of thesecond channel may be the same. In this case, according to thecontinuity equation for a fluid, a flow velocity “v1” of the coolantbefore passing through the separator 400 b, that is, in the first area Aand the second area B and a flow velocity “v2” of the coolant afterpassing through the separator 400 b, that is, in the third area C andthe fourth area D may be the same (∵v1/v2=(h2×w4′)/(h1×w4)=(h3×w5)/(h4×w5′)=1). Accordingly, a coolantcirculation speed may be more easily controlled.

FIGS. 7A and 7B are schematic top views of a cooling device according toother embodiments. The cooling devices according to the presentembodiments may be modifications of the cooling devices according to theabove-described embodiments, and redundant descriptions between theembodiments are omitted.

Referring to FIG. 7A, the cooling device may include the first partition100, the second partition 200 surrounding the first partition 100, thethird partition 300 surrounding the second partition 200, a separator400 c, the inlet 500, and the outlet 600.

The separator 400 c may separate the space between the second partition200 and the third partition 300 into the first area A and the secondarea B, and the space between the second partition 200 and the firstpartition 100 into the third area C and the fourth area D. In theexemplified embodiment, the separator 400 c is configured to extendbetween the third partition 300 and the first partition 100 bypenetrating through the second partition 200.

Unlike the separator 400 b of FIG. 2, the separator 400 c may connectthe first area A and the third area C with each other.

Due to the above configuration, the separator 400 c of FIG. 7A may notchange the direction of the coolant flowing along the fluid channel. Forexample, as illustrated in FIG. 7A, the coolant flowing in the clockwisedirection in the outer area 19 is introduced into the third area C fromthe first area A by the separator 400 c and also flows in the clockwisedirection in the inner area 18. Thus, as the flow direction of thecoolant is maintained, the coolant circulation speed may be maintained.

The structure of the separator 400 c of FIG. 7A is described in detailwith reference to FIGS. 8A and 8B.

FIG. 7B schematically illustrates a modified example of the coolingdevice of FIG. 7A.

Unlike FIG. 7A, the cooling device of FIG. 7B may include two inlets 500a and 500 b, two outlets 600 a and 600 b, and two separators 400 c and400 c′. As illustrated in FIG. 7B, two flows of the coolant introducedthrough the two inlets 500 a and 500 b may be introduced into the innerarea 18 by the separators 400 c and 400 c′, without colliding or mixingwith each other, and may be discharged through the two outlets 600 a and600 b.

FIG. 8A is a perspective view of the separator 400 c used for thecooling devices of FIGS. 7A and 7B. FIG. 8B illustrates that theseparator 400 c of FIGS. 7A and 7B is provided in the fluid channel. Theseparator 400 c according to the present embodiment may be a modifiedexample of the separators according to the above-described embodiments.Redundant descriptions between the embodiments are omitted.

The separator 400 c may include a body 401 c, a first member 405 c, anda second member 406 c. The first member 405 c and the second member 406c may form a channel 402 c.

The first member 405 c and the second member 406 c may be separatelymanufactured and attached to the body 401 c, or may be integrally formedwith the body 401 c.

Referring to FIG. 8B, the first area A and the third area C may beconnected through the channel 402 c of the separator 400 c.

The body 401 c may be arranged across the outer area 19 and the innerarea 18. In the exemplified embodiment, the body 401 c may extend fromthe third partition 300 to the first partition 100 by penetratingthrough the second partition 200.

The first member 405 c may be located between the second partition 200and the third partition 300. The second member 406 c may be locatedbetween the first partition 100 and the second partition 200.

In order to prevent the coolant flows flowing in different directionsfrom being mixed with each other, for example, to prevent the coolant ofthe first area A from being mixed with the coolant of the fourth area D,and the coolant of the first area A from being mixed with the coolant ofthe second area B, one surface of each of the first member 405 c and thesecond member 406 c may come in contact with the second partition 200.In detail, as illustrated in FIG. 8B, the second partition 200 maycontact one surface of the second member 406 c in the fourth area D, andone surface of the first member 405 c in the second area B. Accordingly,the separator 400 c, with the second partition 200, may prevent thecoolant flows flowing in different direction from being mixed with eachother.

In some embodiments, a height h11 of the first member 405 c and a heighth22 of the second member 406 c may be the same. Furthermore, the channel402 c may have a uniform width Wc. In this case, according to thecontinuity equation, the flow velocity “v1” of the coolant beforepassing through the separator 400 c and the flow velocity “v2” of thecoolant after passing through the separator 400 c may be the same (∵v1/v2 =(h22×Wc)/(h11×Wc)). Accordingly, the coolant circulation speedmay be more easily controlled.

FIGS. 9A and 9B are, respectively, appearance and perspective views of acooling device 2 according to another embodiment, and FIG. 9Cillustrates a coolant flow path in the cooling device 2.

Referring to FIG. 9A, the cooling device 2 may include a fluid channel 9through which the coolant flows and a cover 10 covering the fluidchannel 9. The coolant may be a fluid, in particular, gas. A reactiongas inlet 3 may penetrate through the cooling device 2.

One or more circular grooves 11 may be arranged in the fluid channel 9at a certain interval. The grooves 11 may define the flow direction ofthe coolant. Also, the one or more grooves 11 may increase a contactarea between the coolant and the fluid channel 9, and thus an upperportion of a reactor 4, in particular, a gas supply device 5, may bemore effectively cooled (see FIG. 16).

The cover 10 may include an inlet 12 for supplying a coolant, forexample, air, to the fluid channel 9. The inlet 12 may be connected to acoolant input device 14. When the coolant in use is a gas, the coolantinput device 14 may be a fan or a device corresponding thereto. Inanother embodiment, when a liquid coolant is in use, the coolant inputdevice 14 may be a liquid supplier.

Furthermore, the cover 10 may include an outlet 13 configured todischarge the coolant. In this case, the coolant may be dischargedthrough the outlet 13 after cooling the reactor 4 along the grooves 11of the fluid channel 9. The outlet 13 may be connected to a coolantdischarger (not shown). The coolant discharger may be a fan or a devicecorresponding thereto.

In a selective or additional example, a fan connected to the inlet 12and a fan connected to the outlet 13, rotating in opposite directions,may further facilitate the flow of the coolant in the cooling device 2and may effectively control the cooling efficiency. For example, whilerotating in the opposite directions, the fan connected to the inlet 12and the fan connected to the outlet 13 may make the flow of the coolantin the cooling device 2 a laminar flow. Accordingly, the coolingefficiency of the upper portion of the reactor may be more effectivelycontrolled.

In a selective or additional example, the fan connected to the inlet 12and the fan connected to the outlet 13, both having the same rotationspeed, may further facilitate the flow of the coolant in the coolingdevice 2. Alternatively, by making the rotation speed of the fanconnected to the outlet 13 faster than the rotation speed of the fanconnected to the inlet 12, an outflow speed of the coolant supplied tothe fluid channel 9 may be accelerated, and thus the cooling efficiencyof the upper portion of the reactor may be further effectivelycontrolled. Contrarily, by making the rotation speed of the fanconnected to the outlet 13 slower than the rotation speed of the fanconnected to the inlet 12, a time for the coolant staying in the fluidchannel may be extended. Accordingly, the cooling efficiency may becontrolled such that the temperature of the upper portion of the reactoris maintained constant.

The coolant input device 14 and the coolant discharger may be directlyconnected to the inlet 12 and the outlet 13, respectively. In anotherembodiment, the coolant input device 14 and the coolant discharger maybe respectively spaced apart from the inlet 12 and the outlet 13 and maybe connected by a coolant delivery line therebetween.

An insulation body 9-1 is further arranged over the fluid channel 9 andthus a danger that heat is transferred from the fluid channel 9 to aworker in a high temperature process may be prevented.

A separator 20 as described above or below may be arranged on onesurface of the fluid channel 9. In the exemplified embodiment, theseparator 20 may be the separator 400 b illustrated in FIGS. 5A to 5D.

FIG. 9B is a perspective view of the cooling device 2 of FIG. 7A,showing the interior of the cooling device 2. According to FIG. 9B, thecover 10 of the cooling device 2 may include, on one surface thereof, atleast one of a coolant guide plate 15, a first partition 16, and asecond partition 17.

The coolant guide plate 15 may be configured to guide the coolantintroduced through the inlet 12 to flow toward the grooves 11 of thefluid channel 9 and to define a direction in which the coolant flows inthe fluid channel 9. Referring to FIG. 9C, it may be seen that thecoolant is supplied to the fluid channel 9 to flow in differentdirections by the coolant guide plate 15. As described above, thecoolant flows flowing in different directions may prevent the gas supplydevice 5 from being non-uniformly cooled.

The first partition 16 may be configured to prevent mixing of thecoolants introduced in two directions. In the illustrated embodiment,the first partition 16 may be arranged between the two inlets 12 and mayprevent the coolants introduced in two directions through the two inlets12 from being mixed with each other.

The second partition 17 may separate the fluid channel 9 into two areas,that is, the inner area 18 and the outer area 19.

The separator 20 may be arranged on one surface of the fluid channel 9.In the exemplified embodiment, the separator 20 may be the separator 400b illustrated in FIGS. 5A to 5D. In this case, the coolant flowing alongthe grooves 11 in the outer area 19 of the fluid channel 9 may be guidedto the inner area 18 by the separator 20. In particular, since theseparator 20 is composed of two parts, upper and lower parts, asillustrated in FIGS. 5A-5D, the two flows of the coolant flowing indifferent directions in the outer area 19 may be introduced into theinner area 18 without colliding with each other.

The coolant flowing in the inner area 18 along the grooves 11 may bedischarged to the outside through the outlet 13.

FIGS. 10A and 10B schematically illustrate the cover 10 of the coolingdevice 2 of FIG. 9A. FIG. 10A is a front side view of the cover 10, andFIG. 10B is a rear side view of the cover 10.

Referring to FIGS. 10A and 10B, the cover 10 may include the inlet 12,the outlet 13, the coolant guide plate 15, the first partition 16, andthe second partition 17.

Although FIGS. 10A and 10B illustrate that two inlets and one outlet arerespectively arranged as the inlet 12 and the outlet 13, the presentdisclosure is not limited thereto. For example, one inlet and twooutlets may be respectively arranged as the inlet 12 and the outlet 13.

The coolant guide plate 15 is arranged around the inlet 12 to guide thecoolant introduced through the inlet 12 to flow toward the fluid channel9, and may be configured to define the direction in which the coolantflows in the fluid channel 9.

As described above, the first partition 16 may be arranged between thetwo inlets 12 and may prevent the coolants introduced in two directionsthrough the two inlets 12 from being mixed with each other.

As illustrated in FIG. 10B, the second partition 17 may form an emptyspace Z to allow the separator 20 to extend across the inner area 18 andthe outer area 19.

FIG. 11 is a cross-sectional view of the gas supply device 5 includingthe cooling device 2 of FIG. 9C. Referring to FIG. 11, it may be seenthat the fluid channel 9 is separated into the inner area 18 and theouter area 19 by the second partition 17 of the cover 10 of the coolingdevice 2.

The cooling device 2 may be provided over the gas supply device 5. Sincedetailed descriptions about each part of the cooling device 2 of FIG. 11are already presented above in relation to FIG. 9A, FIGS. 10A and 10B,the descriptions are omitted.

FIGS. 12A and 12B are perspective views of the cooling device 2 of FIG.11 before being covered with a cover. FIG. 12A illustrates the coolingdevice 2 before the separator 20 is provided. FIG. 12B illustrates thatthe separator 20 is provided in the fluid channel 9.

Referring to FIGS. 12A and 12B, one or more circular grooves arearranged in the fluid channel 9 at a certain interval. Since thedetailed descriptions about each part of the cooling device 2 of FIGS.12A and 12B are already presented above in relation to FIG. 9A and FIGS.10A and 10B, the descriptions are omitted.

According to other embodiments of the present disclosure, consideringcooling efficiency and non-uniform temperature distribution, the numberand arrangement form of the coolant guide plate, the partition, theseparator, the inlet, the outlet, etc. may be diversified, and thus thecooling efficiency may be improved. In this regard, detaileddescriptions are provided with reference to FIGS. 13A to 15B.

FIGS. 13A and 13B are schematic top views illustrating various flowdirections of the coolant flowing in the cooling device, according toembodiments. According to FIGS. 13A and 13B, various coolant flows maybe implemented by changing the number and/or arrangement form of thecoolant, the coolant guide plate 15, the first partition 16, theseparator 20, the inlet 12, and the outlet 13.

As a first example, the cooling device 2 may include the separator 400 bof FIGS. 5A to 5D, as illustrated in FIG. 13A. In the example, thecoolant is first introduced into the inner area 18 of the fluid channel9 through the two inlets 12. The coolant flows in different directionsalong the groove of the inner area 18 by the coolant guide plate 15and/or the first partition 16. The coolant flowing in the clockwisedirection in the inner area 18 flows in the clockwise direction in theouter area 19 by passing through the second channel 403 b of theseparator 400 b (see FIG. 5A). The coolant flowing in thecounterclockwise direction in the inner area 18 flows in thecounterclockwise direction in the outer area 19 by passing through thefirst channel 402 b of the separator 400 b. The coolant flows flowing indifferent directions in the outer area 19 are discharged through theoutlet 13. According to the present example, the cooling unbalancebetween the left side and the right side of the gas supply device may beprevented, and temperature uniformity may be guaranteed. Furthermore, asdescribed above, since the flow direction of the coolant is not changeddue to the separator 400 b, the flow speed of the coolant may not bedecreased. Accordingly, coolant circulation may be effectivelycontrolled.

As a second example, the cooling device 2 may include the separator 400a of FIGS. 4A and 4B or a partition-type separator, as illustrated inFIG. 13B. In the example, the coolant is first introduced into the outerarea 19 of the fluid channel 9 through the two inlets 12. The coolantflows in different directions along the groove of the outer area 19 bythe coolant guide plate 15 and/or the first partition 16. The coolantflowing in the outer area 19 is discharged through the outlet 13 afterflowing along the groove of the inner area 18 by the separator 400 a(see FIGS. 4A and 4B).

FIGS. 14A and 14B are schematic top views of cooling devices accordingto other embodiments. The cooling devices according to these embodimentsmay be modifications of the cooling devices according to theabove-described embodiments. Redundant descriptions between theembodiments are omitted.

Referring to FIGS. 14A and 14B, the cooling device may include the firstpartition 16, the second partition 17, a third partition 25, the firstseparator 20, and a second separator 24. The third partition 25 may bearranged between the second partition 17 and the reaction gas inlet 3and may separate the fluid channel 9 into the first inner area 18 and asecond inner area 26.

The coolant is first introduced into the outer area 19 of the fluidchannel 9 through the inlet 12. The coolant flows in differentdirections along the groove of the outer area 19 by the coolant guideplate 15 and/or the first partition 16. The coolant flows flowing in theopposite directions in the outer area 19 are guided to flow toward thefirst inner area 18 by the first separator 20 without colliding witheach other. The coolant flows introduced into the first inner area 18and flowing in the opposite directions are guided to flow toward thesecond inner area 26 by the second separator 24 without colliding witheach other, and then are discharged through the outlet 13.

Since the cooling devices of FIGS. 14A and 14B further include the thirdpartition 25 and the second separator 24 compared to the above-describedcooling devices, the coolant may be circulated one more time in thefluid channel 9, and thus the upper portion of the reactor may be moreuniformly cooled.

As it may be seen from FIGS. 14A and 14B, by changing the number and/orarrangement form of the separator 20 and the partition, various coolantflows may be implemented. Accordingly, cooling efficiency of the upperportion of the reactor in a high temperature process may be furtherimproved.

FIGS. 15A and 15B are schematic top views of cooling devices, accordingto other embodiments. The cooling devices according to these embodimentsmay be modifications of the cooling devices according to theabove-described embodiments. Redundant descriptions between theembodiments are omitted.

The cooling devices of FIGS. 15a and 15B may circulate the coolant withonly inlets 15 and 15′ and the coolant input devices 14 and 14′, withoutthe outlet 13 and the coolant discharger connected to the outlet 13. Indetail, instead of the outlet 13 that is not provided, by changing therotation directions of the two coolant input devices 14 and 14′, forexample, the rotation direction of the fan, opposite to each other, thecoolant may be circulated in the outer area 19 and the inner area 18. Inother words, the coolant may be introduced by using one of the two fansand discharged through the other fan, thereby cooling the upper portionof the reactor. In a selective or additional example, the upper portionof the reactor may be cooled by periodically changing the rotationdirections of the two fans (cycling cooling). The present embodiment maybe identically applied to the above-described cooling devices.

FIG. 16 is a schematic cross-sectional view of a substrate processingapparatus including the cooling device, according to another embodiment.An example of the substrate processing apparatus described in thepresent specification may include a deposition apparatus of asemiconductor or display substrate, but the present disclosure is notlimited thereto. The substrate processing apparatus may be any apparatusneeded for performing deposition of a material for forming a thin film,or may refer to an apparatus for uniformly supplying a material foretching to polishing of an object. In the following description, forconvenience of explanation, the substrate processing apparatus isassumed to be a semiconductor deposition apparatus.

The substrate processing apparatus according to an embodiment mayinclude a chamber 1, a plurality of reactors 4, the gas supply device 5,a substrate support 6, the reaction gas inlet 3, the cooling device 2,and a discharge device 8. In FIG. 16, the chamber 1 may include a toplid arranged in an upper portion of the chamber 1, an outer wall forminga side surface and a lower surface of the chamber 1, and an inner spaceI between the top lid and the outer wall.

Referring to FIG. 16, the reactors 4 are provided on the upper surfaceof the chamber 1. The reactors 4 may perform an atomic layer deposition(ALD) or a chemical vapor deposition (CVD), for example.

The substrate support 6 may be arranged corresponding to the gas supplydevice 5, and may be configured to form a reaction space R with the gassupply device 5. When the substrate support 6 and the gas supply device5 form the reaction space R that is an open type, without contactingeach other, a reaction gas may be discharged through the dischargedevice 8 connected to the inner space I. The inner space I may maintaina pressure state lower than the outside atmosphere due to the dischargedevice 8. The discharge device 8 may be, for example, a discharge pump.In the exemplified embodiment, the substrate processing apparatus has alower-end discharge structure, but the present disclosure is not limitedthereto.

Although FIG. 16 illustrates each of the reactors 4 that is an open typein which the substrate support 6 and the gas supply device 5 areseparated from each other, in another embodiment, as the substratesupport 6 or a reactor wall ascends or descends, a peripheral portion ofthe substrate support 6 and the reactor wall have face contact and facesealing, thereby forming the reaction space R. As such, when the reactorwall and the reactor wall contact each other forming a closed-typereaction space, a separate discharge device (not shown) may be providedin each of the reactors 4, for example, in the upper portion of eachreactor 4. Korean Patent No. 624030 discloses one embodiment thereof.

The gas supply device 5 may be arranged on the top lid of the chamber 1facing the substrate support 6 in the reaction space R of each reactor4. The gas supply device 5 may be implemented, for example, in a lateralflow type assembly structure (see Korean Patent No. 624030) or a showerhead type assembly structure. The cooling device 2 may be provided overeach of the reactors 4 or over the gas supply device 5. In theexemplified embodiment, the cooling device 2 may be one of theabove-described cooling devices. The cooling device 2 may be separatelymanufactured and arranged over each of the reactors 4 or the gas supplydevice 5, or the cooling device 2 may be integrally formed with each ofthe reactors 4 or with the gas supply device 5.

The reaction gas inlet 3 may be arranged over each of the reactors 4.For example, the reaction gas inlet 3 may be connected to the gas supplydevice 5 of each reactor 4 and may introduce a reaction gas into thereaction space R. In the exemplified embodiment, the reaction gas inlet3 is connected to the gas supply device 5 by penetrating through thecooling device 2.

A high frequency plasma generation/supply apparatus (not shown) isadditionally arranged over each of the reactors 4 to generate plasma inthe reaction space R or supply radicals to the reaction space R so thata plasma process may be performed in the reaction space R.

To summarize some of the configurations, the substrate processingapparatus according to an embodiment may be described as follows.

The substrate processing apparatus may include the cooling devicecapable of controlling the temperature of the upper portion of thereactor, in detail, the gas supply device, for example, a shower head.

The cooling device may include the separator configured to uniformly andefficiently cool the gas supply device.

The separator enables two flows of the coolant to circulate along thefluid channel 9 without colliding or mixing with each other. Since thecoolant flows are not mixed with each other, a coolant circulation speedmay be maintained and thus cooling efficiency may be improved.

The separators of FIGS. 5A to 5D and FIGS. 8A and 8B prevent mixing ofdifferent coolant flows and simultaneously enable the coolant flow tocirculate along the fluid channel 9 while maintaining the flow directionof the coolant. Accordingly, a coolant circulation speed may bemaintained in the fluid channel 9, and the coolant circulation speed maybe easily controlled by using the coolant input device.

Cooling efficiency may be improved by diversifying the number and/orarrangement form of the coolant guide plate, the partition, theseparator, etc. of the cooling device according to the embodiments ofthe present disclosure.

According to the present disclosure, the temperature of the gas supplydevice may be maintained constant. Accordingly, stability during amaintenance and repair work may be reinforced and reproducibility of aprocess may be improved. Furthermore, malfunction of parts of thereactor at high temperature may be prevented.

The above disclosure provides a plurality of embodiments of thesubstrate processing apparatus including the cooling device, andrepresentative merits thereof. For brevity, only a limited number ofcombinations of related features have been described. However, it isunderstood that the features of any example can be combined with thefeatures of any other example. Moreover, it is to be understood thatthese advantages are non-limiting and that particular advantages arenot, or need not be, features of any particular embodiment.

In order to clearly understand the present disclosure, the shape of eachpart of the accompanying drawings is to be understood as beingillustrative. It should be noted that the present disclosure can bemodified into various shapes other than the shapes shown.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. A cooling device comprising: a first partition; asecond partition surrounding the first partition; a third partitionsurrounding the second partition; and a separator separating a spacebetween the second partition and the third partition into a first areaand a second area, and separating a space between the second partitionand the first partition into a third area and a fourth area, wherein theseparator is configured to connect the first area and the third areawith each other and the second area and the fourth area with each other.2. The cooling device of claim 1, wherein the separator comprises abody, a first channel, and a second channel, the first area and thethird area are connected to each other by the first channel of theseparator, the second area and the fourth area are connected to eachother by the second channel of the separator, and the first channel andthe second channel do not meet each other.
 3. The cooling device ofclaim 2, wherein the first channel is in an upper portion of theseparator, and the second channel is in a lower portion of theseparator.
 4. The cooling device of claim 1, wherein the separatorcomprises: a body; a first member located in an upper portion of theseparator and between the second partition and the third partition; asecond member located in the upper portion of the separator and betweenthe first partition and the second partition; a third member located ina lower portion of the separator and between the second partition andthe third partition; a fourth member located in the lower portion of theseparator and between the first partition and the second partition; afirst channel formed by the first member and the second member; and asecond channel formed by the third member and the fourth member, whereinthe first area and the third area are connected to each other by thefirst channel, wherein the second area and the fourth area are connectedto each other by the second channel, and wherein the first channel andthe second channel do not meet each other.
 5. The cooling device ofclaim 4, wherein one surface of each of the first member, the secondmember, the third member, and the fourth member contacts the secondpartition.
 6. The cooling device of claim 4, wherein the first memberand the third member contact the third partition, and the second memberand the fourth member contact the first partition.
 7. The cooling deviceof claim 4, wherein the first member, the second member, the thirdmember, and the fourth member have the same height, and the firstchannel and the second channel each have a same uniform width.
 8. Thecooling device of claim 1, wherein the cooling device further comprisesan inlet for introducing a coolant, and, when the inlet is locatedbetween the second partition and the third partition, the separatorenables the coolant flowing in a clockwise direction between the secondpartition and the third partition to continue to flow in a clockwisedirection between the first partition and the second partition, and theseparator enables the coolant flowing in a counterclockwise directionbetween the second partition and the third partition to continue to flowin a counterclockwise direction between the first partition and thesecond partition, and when the inlet is located between the firstpartition and the second partition, the separator enables the coolantflowing in a clockwise direction between the first partition and thesecond partition to continue to flow in a clockwise direction betweenthe second partition and the third partition, and the separator enablesthe coolant flowing in a counterclockwise direction between the firstpartition and the second partition to continue to flow in acounterclockwise direction between the second partition and the thirdpartition.
 9. The cooling device of claim 1, further comprising one ormore grooves arranged between the first partition and the secondpartition or between the second partition and the third partition.
 10. Acooling device comprising: a fluid channel through which a coolantcirculates, the coolant being introduced through at least one inlet; apartition separating the fluid channel into a first area and a secondarea; and a separator penetrating through the partition and extendingacross the first area and the second area, wherein the at least oneinlet introduces the coolant into the first area, wherein two flows ofthe coolant flowing in different directions are formed in the firstarea, and wherein the two flows of the coolant flowing in differentdirections in the first area are introduced into the second area via theseparator without colliding or mixing with each other.
 11. The coolingdevice of claim 10, wherein the separator enables the coolant flowing ina clockwise direction in the first area to continue to flow in aclockwise direction in the second area, and the separator enables thecoolant flowing in a counterclockwise direction in the first area tocontinue to flow in a counterclockwise direction in the second area. 12.A cooling device comprising: a first partition; a second partitionsurrounding the first partition; a third partition surrounding thesecond partition; and a separator separating a space between the secondpartition and the third partition into a first area and a second area,and separating a space between the second partition and the firstpartition into a third area and a fourth area, wherein the separator isconfigured to connect the first area and the third area with each other.13. The cooling device of claim 12, wherein the separator comprises abody and a channel, and the first area and the third area are connectedto each other by the channel of the separator.
 14. The cooling device ofclaim 12, wherein the separator comprises: a body; a first memberlocated between the second partition and the third partition; a secondmember located between the first partition and the second partition; anda channel formed by the first member and the second member, wherein thefirst area and the third area are connected to each other by thechannel.
 15. The cooling device of claim 14, wherein one surface of eachof the first member and the second member contacts the second partition.16. The cooling device of claim 14, wherein the first member contactsthe third partition, and the second member contacts the first partition.17. The cooling device of claim 14, wherein the first member and thesecond member have a same height, and the channel has a uniform width.18. The cooling device of claim 12, wherein, when a flow direction ofthe coolant in the first area is a clockwise direction, the separatorenables the coolant flowing in a clockwise direction in the first areato continue to flow in a clockwise direction in the third area, and whena flow direction of the coolant in the first area is a counterclockwisedirection, the separator enables the coolant flowing in acounterclockwise direction in the first area to continue to flow in acounterclockwise direction in the third area.
 19. A gas supply devicecomprising a cooling device, the cooling device comprising: a firstpartition; a second partition surrounding the first partition; a thirdpartition surrounding the second partition; and a separator separating aspace between the second partition and the third partition into a firstarea and a second area, and separating a space between the secondpartition and the first partition into a third area and a fourth area,wherein the separator is configured to connect the first area and thethird area with each other, or to connect the first area and the thirdarea with each other and the second area and the fourth area with eachother.
 20. A substrate processing apparatus comprising: a chamber havingan inner space surrounded by a top lid and an outer wall; at least onereactor located in the top lid and comprising a gas supply device; atleast one substrate support located on a wall of the chamber and facingthe reactor; a reaction space formed between the reactor and thesubstrate support; and a cooling device provided over the reactor orover the gas supply device, wherein the cooling device comprising: afirst partition; a second partition surrounding the first partition; athird partition surrounding the second partition; and a separatorseparating a space between the second partition and the third partitioninto a first area and a second area, and separating a space between thesecond partition and the first partition into a third area and a fourtharea, and wherein the separator is configured to connect the first areaand the third area with each other, or to connect the first area and thethird area with each other and the second area and the fourth area witheach other.